High Adhesion Matte Black Single-Sided Tape for Slim Electronic Designs

DTTAS10BZ is a 10-micron matte black single-sided adhesive tape developed for ultra-slim product design requirements. Featuring strong adhesion and reliable weather resistance, this tape delivers stable bonding performance in diverse working environments. It supports professional die-cutting and edge-wrapping processing, which perfectly fits the assembly needs of intricate structural parts. Meanwhile, the product boasts excellent electrical insulation properties, making it an ideal bonding and protection material for graphite sheets and other electronic components widely used in consumer electronics, smart devices and precision electrical products.

Constructed with a composite structure of release film, acrylic adhesive, PET polyester film and black ink coating, this matte black tape integrates multiple functional advantages. Its overall thickness ranges from 9μm to 12μm, which will not increase the overall thickness of finished products while ensuring firm attachment. Tested in accordance with international and national standards, it has a 180° peel strength of no less than 500g/25mm, with stable matte appearance and uniform color performance. The product also features outstanding electrical insulation capacity with surface impedance higher than 10⁹Ω, effectively isolating current and preventing electric leakage for electronic assemblies.

Engineered to withstand temperatures from -5°C to 100°C, DTTAS10BZ maintains stable physical and adhesive properties under normal high and low temperature conditions. With standardized glossiness and color difference parameters, the matte black surface presents a neat and consistent visual effect, meeting the appearance requirements of high-end electronic products. Beyond graphite material bonding, it is also extensively applied to internal fixation, insulation shielding, surface covering and edge wrapping of mobile phones, tablets, wearable electronics, household electrical appliances and other slim electronic products, serving as a versatile adhesive solution for modern lightweight and miniaturized electronic manufacturing.

• General bonding of electronics, plastic, and metal parts
• Home appliance component assembly and fixation
• Automotive interior trim and part bonding
• Packaging box reinforcement and sealing
• PCB board temporary fixing during processing
• Display panel frame bonding and positioning

Structure

Sanfeng Win New Materials (Jiangsu) Co., Ltd. (Sanfeng Win), founded in 2010, is a private enterprise integrating R&D, production, and sales of adhesive products. With industry-leading coating technology and a professional R&D team, we specialize in high-temperature resistant tapes, optical protective films, new energy battery blue films, aerogel packaging hot-pressing films, photovoltaic perforated tapes, and backsheets. Our products are widely used in electronics, mobile phone screens, PCB, powder spraying, insulation, die-cutting, printing plastics, battery cell aluminum case wrapping, FPC, new energy, and photovoltaic industries. Equipped with precision coating equipment, a high-purification clean workshop, and a multi-functional composite precision coating production line, we provide customers with R&D, design solutions, and market application feedback, enabling independent mass production services to ensure product quality.

1.    What is the substrate material?

   It uses PET (polyester film) as the base material with acrylic adhesive on both sides.

2.    What is the total thickness?

   The total thickness is 100±5μm, providing stable and sturdy bonding.

3.    Does it have good adhesion?

   Yes, the 180° peel strength is at least 1000g/25mm, ensuring strong bonding.

4.    What temperature can it withstand?

   It works stably within the range of -5℃ to 80℃.

5.    Is it suitable for plastic bonding?

   Yes, it offers excellent adhesion to various plastics, metals, and electronic components.

6.    Can it be used for temporary fixing?

   Yes, it works well for temporary fixing during processing and assembly.